BGA Rework
BGA Rework
We specialize in Ball Grid Array (BGA) rework and repair, delivering precision and reliability for complex PCB assemblies. Our facility is equipped with advanced rework stations capable of handling fine-pitch BGAs, micro-BGAs, and other high-density packages with exceptional accuracy.
Our skilled and experienced technicians are trained to perform delicate removal, replacement, and rebelling processes while maintaining the integrity of your PCB. We follow strict thermal profiling to prevent heat damage and ensure optimal solder joint quality.
Whether correcting assembly defects, upgrading components, or salvaging high-value boards, our BGA rework services restore products to full functionality, reducing scrap costs and extending product life. We cater to industries where precision and reliability are critical, including automotive, industrial electronics, medical devices, and telecommunications.